Bisphenol F, mixture of acetates and propionates

Epoxy curative with good thermal properties.• Stable• Low viscosity• Does not impede free radical cure• Thermoset adhesives• Curative for epoxy/(meth) acrylate hybrids• Hybrid epoxy/free radical thermosets
Supplier BOC Sciences
Product # 1044764-71-7
Pricing Inquire
Cas 1044764-71-7
Molecular Weight 314.4
Molecular Formula C19H22O4
Canonical SMILES CCC1=CC=C(C=C1)OC(=O)C.CCC(=O)OC1=CC=CC=C1
Feedback