2,2'-Diallyl bisphenol A diacetate ether
Epoxy curative with good thermal properties.• Stable• Low viscosity• Does not impede free radical cure• Thermoset adhesives• Curative for epoxy/(meth) acrylate hybrids• Hybrid epoxy/free radical thermosets
| Supplier | BOC Sciences |
|---|---|
| Product # | 1071466-61-9 |
| Pricing | Inquire |
| Cas | 1071466-61-9 |
| Molecular Weight | 392.49 |
| Molecular Formula | C25H28O4 |
| Canonical SMILES | CC(=O)OC1=C(C=C(C=C1)C(C)(C)C2=CC(=C(C=C2)OC(=O)C)CC=C)CC=C |